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Rigid-Flex Board

Rigid-Flex Board

    Model NO.: R10802 Processing Technology: Etching BaseMaterial: Copper Insulation Materials: Epoxy Resin Dimensions: 322.07X258.57mm Min.Space: 0.15mm Min. Line: 0.15mm Min. Pth: 15um Aspect Tatio: 0.8 Stiffener: Polyimide Surface: Enig Trademark: Xiamen Bolion Transport Package: Pices Specification: IPC 6013 I / II / III Origin: China HS Code: 85340010