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100%Test Fr4 HDI 0.1mm Rigid PCB

100%Test Fr4 HDI 0.1mm Rigid PCB

    Rigid PCB Manufacturing Capabilities Total Pad Size Standard Advanced Capture Pad Drill + 0.008 Drill + 0.006 Landing Pad Drill + 0.008 Drill + 0.006 BC Mechanical Drill (Type III) 0.008 0.006 Laser Drill Size 0.004-0.010 0.0025 Material Thickness 0.0035 0.0025 Stacked Via Yes Yes Type I Capabilities single & Double Deep Yes Yes Type II Capabilities Buried Vias with Microvias Yes Yes Type III Capabilities Yes Yes Copper Filled Microvia Yes Yes Smallest Copper Filled Microvia 0.004 0.0025 Copper Filled Microvia Aspect Ratio 0.75:1 1:01 Smallest Laser Microvia Hole Size 0.004 0.0025 Laser Via Aspect Ratio (Depth:Diameter) 0.75:1 1:01 Rigid PCB Assembly Capabilities If bare PCB is bone, PCB assembly is flesh and blood. PCB assembly highly determines the total quality of PCBA funtions. Our sophisticated engineers excute SOPs and weekly training to ensure the manufacturing processes. Advanced SMT lines can catch up with your demand of high-precision soldering, such as 0201, 0.25mm BGAs, PQFP, PLCC, SOP, SOJ etc. Now we have 7 SMT assembly lines, 4 DIP lines and 3 box build lines.