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PCB Mobile Phone Board Manufacturing

PCB Mobile Phone Board Manufacturing

    Basic Info • Type: Rigid Circuit Board • Material: Fiberglass Epoxy • Flame Retardant Properties: V0 • Processing Technology: HASL • Insulation Materials: Organic Resin • Surface Finish: HASL/ Enig/OSP • Min. Line Space: 0.075mm/ 3mil • Copper Thickness: 0.5oz - 10 Oz • Specification: any size •...