Model NO.: Multilayer PCB
Dielectric: FR-4
Application: Communication
Mechanical Rigid: Rigid
Base Material: Copper
Brand: FD
Transport Package: CTN
Origin: China
Type: Rigid Circuit Board
Material: Paper Phenolic Copper Foil Substrate
Flame Retardant Properties: V0
Processing Technology: OSP
Insulation Materials: Organic Resin
Trademark: N/A
Specification: 30*30
HS Code: 8534009000
Our main products range form copper or aluminum base substrates to laminates with all kinds of surface treatment, from single-sided single-layer to multi-sided multi-layers. Whatever you required, we'll achieve your satisfication. We can offer you the best PCB and PCB assembly services at low-to-large volume, verified by ISO09001,including FR-4,flexible,rigid-flex,carbon ink, aluminum types. We are capable of controlled impedance, heavy copper, HDI, blind & buried vias and small chips down to 0201 and 0.25 mm BGA.
