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HDI Multilayer PCB Mobile Phone BGA Circuit Board

HDI Multilayer PCB Mobile Phone BGA Circuit Board

    type: Rigid Circuit Board Material: Fiberglass Epoxy Flame Retardant Properties: V0 Processing Technology: Electrolytic Foil Insulation Materials: Epoxy Resin Min. Hole Size: 0.2mm Certificates: UL, RoHS, SGS, ISO9001 ISO14000 Soldermask: Green, Blue, White, Black, Yellow, Red Trademark: FOUND Origin: Shengzhen Dielectric: FR-4 Application: Communication Mechanical Rigid: Rigid Base Material: Fr4 High Tg Brand: Shengyi,Kb,Nanya,Ilm Min. Line Width&Spacing: 0.1mm/0.1mm Shipping: DHL, UPS, TNT, FedEx, etc Silkscreen: White, Black,Blue, Yellow Transport Package: by Vacuum Packing in Cartons HS Code: 8534001000