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HDI High Frequency Mobile Phone BGA PCB

HDI High Frequency Mobile Phone BGA PCB

    Layers: 2 layer board, Materials: ROGERS 4350B/4003/5880/3003/3010/RO6010 Finished board thickness:1.6mm Special:plating edge board Surface treatment: HASL , Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating Min. Hole Size:3mil (0.075mm) Min. Line Width:3 Mil (0.075 Mm) Min. Line Spacing:3 Mil (0.075 Mm) Surface Finishing:HASL/ Immersion Gold Solder mask:Green; Blue; Black; Red; Yellow; white,etc.