Home > About Us > Technical Capabilities

Technical Capabilities

Item

process capacity

No. of layer

Double side to 20 Layers.Build up 2+N+2,Double Sided aluminium PCB , metal core PCB

Materials

FR-4 ,CEM-1/3,HF material,Teflon,Rogers,Bergquist,high TG,PTFE,aluminum.

Board thickness

0.1mm to 4.0mm  0.4mm up for 4 layers  4.0mm for 16 layers

Copper cladding

(inner)18um to 105um  (Outer)12um to 210um

Maximum size

500*1500mm

Minimun trace

(width/spacing)0.075mm

Hole size tolerance

(NPTH)±0.075mm  (PTH)±0.05mm

Diameter tolerance

(NPTH)±2mil (PTH)±3mil

Min.Distance hole/line to edge

20mil 12mil

Minimun welding ring thickiness

0.1mm

Minimun isolation pad

10mil

Minimun solder mask width

0.075mm

Minimum solder window

0.05mm

Impedance tolerance

±10%

Minimun hole size

Finish,mechanical -0.15mm
Finish,laser -0.10mm

Aspect ratio

Vias≤10:1
Build vias≤0.7:1

Surface finishs

HAL,Immersion gold,Flash gold, Pre-flux(OSP),Selective gold plates and gold tabs,Stripping blue glue,Carbon oil,Pure tin plating,silver plating,tin plating,thickness Finger plating.

Quality Standards

Accept spcifications of customer and IPC(class II or III)